America-based critical digital infrastructure and continuity solutions brand Vertiv has announced the new CoolLoop Trim Cooler designed to support both air and liquid cooling applications for AI and high-performance computing (HPC), thus providing yet another option for data center owners as well as AI factories across the world.
The CoolLoop Trim Cooler is created to allow seamless integration with high-density, liquid-cooled environments for enhanced operational efficiency through its up to 70% reduction in annual cooling energy consumption through free cooling and mechanical operation in addition to the 40% additional space savings compared to conventional systems.
The fluctuating user traffic may lead to different spikes or downs in terms of processing, which can affect the temperature of the cooling water/ cold plates but the CoolLoop Trim Cooler is designed to tackle that as it can handle water of up to 40°C and cold plate functionality at 45°C.
Customers who are using or plan to utilize the Vertiv CoolChip CDU coolant distribution units for direct-to-chip cooling can also enjoy smooth integration and full compatibility with CoolLoop Trimp Cooler as it can be connected directly to immersion cooling systems for a simplified installation and reduced operational complexity.
Additionally, the CoolLoop Trim Cooler utilizes low-GWP refrigerant and offers a scalable cooling capacity of up to nearly 3 MW in its air-cooled configuration. With free cooling coils optimized for high ambient temperatures, it can operate in free cooling mode across more seasons, reducing electrical consumption and COâ‚‚ emissions. It also complies with the 2027 EU F-GAS regulations, eliminating the need for costly redesigns or infrastructure upgrades to meet future regulatory requirements.
