Vertiv has announced that its 2.3 MW CoolChip coolant distribution unit has become the first CDU model to qualify specifically as NVIDIA DSX Ready. It’s part of the initial wave of qualified CDU solutions under NVIDIA’s broader DSX Ready program, which helps AI factory builders identify power and cooling products that actually meet NVIDIA’s technical requirements.
For context, a CDU manages the flow and temperature of liquid coolant used to pull heat away from dense computing systems. Vertiv’s qualified 2.3 MW model is part of its broader liquid-to-liquid CDU lineup, supporting both direct-to-chip cooling and rear-door heat exchanger setups, and it’s built to be installed either at the end of a server row or along a room’s perimeter.
Through the NVIDIA DSX AI Factory platform, AI data centers are being designed and operated more tightly than ever, covering everything from compute and networking to power, cooling, facilities, and software as one connected system. As computing density keeps climbing, factors like power availability, water access, and grid capacity increasingly dictate what builders can realistically deploy, and that’s exactly where DSX Ready comes in, giving specific products a validated link to NVIDIA’s actual technical requirements.
Vertiv has made the case that AI deployment at scale is forcing data center infrastructure decisions to become a lot more integrated than they used to be. Hence, NVIDIA DSX Ready is an easy way to give customers a more consistent way to evaluate critical infrastructure while continuing Vertiv’s ongoing focus on providing the thermal engineering and lifecycle support that increasingly complex AI environments actually need.
