Cadence has announced a deeper, multi-year partnership with Intel Foundry to accelerate Team Blue’s development in next-generation 14A manufacturing process.
The collaboration expands beyond existing work by combining Cadence’s AI-powered electronic design automation (EDA) tools and design IP portfolio with Intel’s process technology and packaging expertise, giving chip designers a more optimized path to building future high-performance computing (HPC) and mobile processors.
One of the major focuses within the agreement comes in the form of Design Technology Co-Optimization (DTCO), where both companies will jointly refine tools, workflows, and methodologies to improve performance, power efficiency, and chip area (PPA). The partnership will also work toward delivering production-ready Process Design Kits (PDKs) for Intel 14A, helping customers begin designing chips on the new node with greater confidence while reducing development risks and shortening time-to-market through Cadence’s agentic AI-driven design flows.
Cadence President and CEO Anirudh Devgan described the expanded relationship as a significant milestone, saying the closer partnership combines the strengths of both companies to help customers achieve higher levels of performance, power efficiency, and innovation for next-generation semiconductor products.
Intel Foundry Executive Vice President and General Manager Naga Chandrasekaran said the collaboration aligns with Intel Foundry’s roadmap and ecosystem strategy. By pairing its process and advanced packaging technologies with Cadence’s AI-driven design solutions, they aim to strengthen co-optimization across the design process while better supporting customers developing future semiconductor products.
