ECSIPC has announced that it is attending InfoComm 2023 to unveil its latest LIVA Mini PC series and motherboard solutions tailored for commercial settings. Let’s take a quick look.
To begin, the new LIVA Z5 Plus and LIVA Z5E Plus mini PCs are equipped with 13th Gen Intel Core CPUs for highly capable performance at minimal power use while offering the capability to connect up to four 4K monitors at the same time. For storage, users can enjoy the benefits of a superfast M.2 2280 PCI-E NVMe Gen-4×4 SSD and the option of a 2.5-inch SATA SSD in the case of the Z5E Plus model.
In terms of connectivity, the devices feature HDMI with CEC, DisplayPort, and DP over USB Type-C display connections, USB 4, and USB 3 ports, along with two 2.5GbE, Wi-Fi 6 connectivity, and so on for a variety of use cases and applications.
When it comes to the barebone ones, the LIVA One H610 and B660 mini PCs are compatible with 13th Gen Intel Core CPUs (65W) with up to 24 CPU cores to elevate productivity for a broad range of business and edge applications. Not only that, but they also support up to 64GB RAM, up to four displays simultaneously, as well as quick Wi-Fi 6 connectivity, and many more.
For the industrial motherboard section, the B760H7-M20 supports 13th Gen Intel Core CPUs and DDR5 memory of up to 64GB capacity, alongside a PCIe 16x Gen 5 primary expansion slot, two M.2 slots (2280 and 2230), and a plethora of USB ports including USB-C and several display outputs.
On the other hand, the H610H7-IM1 adopts a different layout to accommodate 2 DIMMS of dual channel DDR4 up to 64GB. Notably, it features 10 COM ports and ensures support for wide temperature operation, demonstrating its suitability for diverse machines.
That’s not all, ECSIPC is exhibiting even more products at InfoComm 2023 from 14th June to 16 June 2023, so head over to Stand #1461, Orange County Convention Center if you’re close by!