MSI Computex 2023 28

While we have seen plenty of highly efficient chips being produced for low-power devices, the upper-end spectrum of high-demand computing still relies upon the silicon’s raw power to deliver maximum performance. That goes without saying, GPUs nowadays are getting massive due to the use of gigantic heatsinks to cool the chip.

MSI has showcased a number of technologies the are currently working on and hoping to bring to consumer in the future.

Dynamic Bimetallic Fins

MSI Computex 2023 29

What is shown here is an individual fin from the heatsink stack. Looking closely at the stack, you can see a thin piece of copper sandwiched between two pieces of aluminium fins.

MSI Computex 2023 30

The combined thickness of this composite fin is about 1mm and utilising the different thermal conductivity of the material to increase the heat dissipation.

MSI Computex 2023 31

The end result is this – an interesting-looking heatsink module for a GPU.

Arctic Blast

MSI Computex 2023 32

TEC or Thermoelectric Cooler works like a Peltier cooler that actively transfers heat from one side to the other. Combining this with an AIO cooler would drastically increase the cooling capacity.

MSI Computex 2023 33

What is shown here is a prototype of the cold plate. I am very interested to see how MSI can mix and match this technology with other cooling solutions instead of just slapping a Peltier cooler on a GPU.


MSI Computex 2023 36

FusionChill is a technology that combines both water-cooling and air-cooling in a single on-card cooling solution.

MSI Computex 2023 37

By tightly strapping an AIO and radiator to the GPU, one can achieve this feat albeit the GPU will look way thicker than it would. However, this might seem to be a feasible way to do it.

MSI Computex 2023 38

The radiator fins are also arranged in a way that the hotter water flow side will get a higher density fin arrangement to increase the surface area.

MSI DynaVC Technology

MSI Computex 2023 39

Vapour chamber technology is not new but what MSI is trying to achieve here is by creating a 3-dimensional vapour chamber that directly connects the heat pipes to the copper base.

MSI Computex 2023 40

Yes, you read that right, instead of the conventional way of sandwiching the heat pipes within the base, they are trying to manufacture the heat pipes and base together.

MSI Computex 2023 41

Surely some of these technologies may sound crazy but that’s how we progress throughout the years, by trying out different ideas or combining different technologies to make better products. I certainly hope to see any of these technologies shown can finally reach consumers with all the promised benefits.


Related Posts

Subscribe via Email

Enter your email address to subscribe to Tech-Critter and receive notifications of new posts by email.