AMD has recently announced the new Ryzen 7000 Series processors that many of us have long awaited for. From the early specifications as seen during the AMD Computex 2020 keynote, we can see that the new-gen Ryzen CPU features a new LGA 1718 socket and will support new features such as DDR5 memory and PCIe 5.0.
This means that a brand new chipset motherboard is required to support the new CPU and the new features it has to offer. MSI as one of the renowned board partners will be releasing their X670E, X670, and B650. So let’s see what MSI has on the table for now.
First up is the MEG X670 GODLIKE and MEG X670 ACE which take on the E-ATX PCB size and features a beefy 24+2 VRM phases with 105A Smart Power Stage. They come with a stacked fin array design heatsink and a heat pipe to dissipate heat effectively, as well as a MOSFET baseplate for better heat dissipation for the VRM and a metal backplate to protect the PCB while maintaining the rigidity of the board.
The MEG Series motherboards provide up to 4 onboard M.2 slots, comprised of 1 M.2 PCIe 5.0 x4 slot and an M.2 XPANDER-Z GEN5 DUAL add-on card inside the box for 2 additional PCIe 5.0 x4 M.2 slots.
The MPG Series has received significant enhancements for the new AMD platform. Thanks to the implementation of a carbon black color scheme, the MPG X670E CARBON WIFI is steadier than before. This motherboard comes with 18+2 VRM power phases with 90A and features 2 PCIe 5.0 x16 slots and 4 M.2 slots that are split into 2 M.2 PCIe 5.0 x4 and 2 PCIe 5.0 x4.
For the PRO Series which is widely loved by creators and enterprises, 14+2 Phases Duet Rail Power System and dual 8-pin CPU power connectors are featured in the PRO X670-P WIFI. It is equipped with 1 M.2 PCIe 5.0 x4 slot, 2.5G LAN, and Wi-Fi 6E solution, making it easier to connect to the internet.
These are all the information that we have for now from MSI, expect more details to come very soon after these motherboards go official alongside the upcoming Ryzen 7000 series CPUs.
