The Intel Arrow Lake-S CPUs have shown that Team Blue turned against its year-long philosophy of “anything for highest boost clock” approach in CPUs and now instead focuses on power efficiency via last year’s unlocked SKUs. At CES 2025, we now have the non-K models to serve the mainstream market.

Noctua Intel LGA1851 Core Ultra 200S Compatibility

The new lineup covers quite the ground starting with 10 cores and going all the way up to 24. Aside from the usual difference in boost clock frequencies and cache, they maintained the same memory capacity support and PCIe lanes including 16 PCIe 5.0 for GPU, 4 PCIe 5.0 for SSDs, and 4 PCIE 4.0 for slower and less power-hungry stuff. They are also closing the CUDIMM doorway since non-power users wouldn’t need that sort of stuff anyway.

In terms of AI performance, the Arrow Lake-S processors deliver between 19 and 36 TOPS, which falls short of the requirements for Microsoft’s Copilot+ PCs. As a result, systems based on these processors will not support certain advanced Windows 11 features. But if you need to use its iGPU because the 2025 GPUs are on their way and somehow you’re stuck between this transition period, the up to 4 core config with Xe2 LPG microarchitecture should do the trick. Users will also get up to 2x Thunderbolt4 ports, DP 2.1, and HDMI 2.1 outputs.

Here’s a quick specs rundown for all 11 SKUs.

Model

Cores (P+E)/Threads

Boost Clock (P/E) GHz

TOPs

Smart Cache

TDP

Deep Learning Boost Support

Max RAM

GPU Cores / TOPS

PCIe Lanes

Core Ultra 9 285T

8+16 / 245.4 / 4.63636MB65W-182WYes192GB DDR5-64004 / 824
Core Ultra 9 2855.3 / 4.6

35

35W-112W

Core Ultra 7 265

8+12 / 20

5.2 / 4.6

33

30MB

65W-182W

Core Ultra 7 265F

25

N/A

Core Ultra 7 265T3335W-112W

4 / 8

Core Ultra 5 245

6+8 / 14

5.1 / 4.5

29

24MB

65W-121W

Core Ultra 5 245T

36W-114W

Core Ultra 5 2355 / 4.4

27

65W-121W

3 / 6

Core Ultra 5 235T

35W-114W

Core Ultra 5 225

6+4 / 10

23

20MB

65W-121W

2 / 4

Core Ultra 5 225F

4.9 / 4.4

19

N/A

The Arrow Lake-S CPUs are manufactured by TSMC using a mix of advanced process technologies of N3B for compute tiles, N5P for graphics tiles, and N6 for SoC and I/O tiles with assembly provided by Intel’s Foveros 3D packaging technology.

Availability

January 13 will be the official launch date for these new Core Ultra 200S processors.

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