At COMPUTEX 2026, Ventiva announced a strategic partnership with ASUS to explore next-generation thermal solutions for compact AI computing systems, with both companies evaluating how Ventiva’s ionic cooling technology can be integrated into future ASUS NUC and Mini PC platforms.
As AI workloads continue to demand greater processing power within increasingly compact devices, thermal management has become a key challenge for system designers. Traditional cooling solutions often occupy valuable board space, limit component placement flexibility, and introduce noise and vibration that become more difficult to manage in smaller, high-performance systems.
To address these limitations, Ventiva’s ionic cooling technology offers a compact, solid-state thermal solution that uses electrically charged particles generated by a small plasma field to move air without any rotating components. This enables targeted heat dissipation while eliminating the noise and vibrations associated with traditional cooling systems, with measured noise levels below 15dBA.
Its modular design also helps recover valuable board space and increase layout flexibility for system designers. Unlike conventional top-in/side-out blowers, Ventiva’s side-in/side-out airflow architecture does not require an air intake gap, allowing system heights as low as 5mm and paving the way for thinner, more compact device designs.
Through this partnership, Ventiva and ASUS will evaluate the integration of Ventiva’s ionic cooling technology into future ASUS AI system architectures, exploring its potential to enhance thermal design in compact computing platforms.
Not only that, Ventiva is showcasing an ASUS NUC demonstration system at COMPUTEX 2026, providing a real-world platform to assess next-generation cooling concepts for AI-capable devices.
