BIOSTAR is now showcasing its latest AI-powered industrial PCs and edge computing solutions at Embedded World 2025, taking place from 11th to 13th March at Nurnberg Messe, Germany.
For starters, the showcase includes industrial PC systems which include the MS-X7433RE, MS-1345UE, and MT PRO-J6412, along with IPC motherboards in various form factors, such as the BIQ67-AHP and BIH61-AHA for ATX, BIADN-IHT and BIH61-IHP for Mini-ITX, as well as SBC models like BIELK-PAT, BIAST-PAT, and BIRPL-PAT.
The brand also highlights support for HAILO 8 and DEEPX DX-M1 AI accelerator cards, which are tailored to enhance computing power in next-generation AI-driven solutions.
Following that, BIOSTAR presents the ERX93-AXP ARM-based IPC motherboard, engineered for stronger performance in edge computing applications. Powered by NXP solutions, it is specifically optimized for industrial environments to ensure robust and reliable processing capabilities.
In addition, the BIOSTAR AI-NONXS platform debuts at the exhibition, introducing support for the new NVIDIA Jetson Orin NX series and Jetson Orin Nano series modules, JetPack 6.2 and Super Mode, together with generative AI models such as LLM, ViTs, VLM, Stable Diffusion, DeepSeek R1, Ollama, and Gemma.
Another major highlight is the collabpration between BIOSTAR and DEEPX, presenting BIOSTAR’s AMD B650 motherboards and storage devices alongside DEEPX’s AI accelerators: the DX-H1 PCIe x16 (Bifurcation x4x4x4x4) module. The demonstration showcases advanced object detection, highlighting the seamless integration and scalability of both companies’ technologies in Edge AI applications.
