Long have we waited and ASUS has officially revealed the all-new Zenfone 8 series smartphones.
ASUS unveiled its new direction for its TUF series motherboard during last week’s APAC Technical Seminar, where the TUF series motherboards that we used to know will no longer be the same.
Based on the new product positioning from ASUS, the TUF series motherboards has been rebranded into TUF Gaming that is made for the mass, the value oriented gaming motherboard for budget gamers who doesn’t really need the extra fancy features like Sonic Studio III for gaming, or OptiMEM for memory overclocking.
2 new TUF Gaming motherboard introduced in this release are the TUF Z370-PLUS Gaming and Z370-PRO Gaming that comes with a striking design for its PCB such as the digital camo, military jet plane inspired patterns, etc. The design looks good in overall, but the most noticeable difference compared to the previous TUF series motherboards is that both the Z370-PLUS Gaming and Z370-PRO Gaming both comes without the TUF series signature Thermal Armor and TUF Fortifier.
According to ASUS, there will be no armor kit for the TUF gaming motherboard like the Gryphon Armor Kit in the past. We find this as a big disappointment for the TUF fans because the Thermal Armor and TUF Fortifier is what makes TUF motherboards unique in its own way.
ASUS claimed that they are still maintaining the renown durability and reliablity of TUF series motherboards, but with a twist of gaming elements to make TUF Gaming motherboards as the best value gaming motherboard for the budget oriented gamers.