TEAMGROUP has formally revealed its line of products at COMPUTEX 2021 which features both existing yet powerful and upcoming all-new items. Let’s take a look at them.

Exclusive Heat Dissipation Design

TEAMGROUP COMPUTEX 2021 1

While not the latest but these 2 are definitely some of the greatest. The T-FORCE CARDEA A440 PCIe 4.0 equips a patented 2 heatsink design made of aluminum and graphene to tackle the immense heat produced by the ultra-high transfer speed of PCIe 4.0 while the T-FORCE CARDEA Ceramic C440 uses aerospace ceramic materials which are both elegant, light, and proven sufficient to remove PCIe 4.0 levels of excessive heat too.

Pushing Capacity Baseline for Futureproofing

TEAMGROUP COMPUTEX 2021 2

As time goes on, the demand for higher capacity memory products will grow as well and with how contents and data can grow to tremendous sizes to both be processed or stored, the need for breaking the capacity ceiling as well as the baseline numbers are crucial in keeping up the scaling of computing power. Hence, TEAMGROUP debuted the new T-FORCE XTREEM ARGB that goes up to 32GBx8 for a total of 256GB DDR4 volatile memory. Flipping to the other side, we have the MP34Q M.2 PCIe SSD that features the latest 3D QLC flash memory stacking together for a maximum of 8TB of storage with speeds of 3.0GB/s reads while fulling standards of lower power consumption and vibrating resistance. Swapping the form factor to microSD and both the T-FORCE GAMING A2 and GO 4K Micro SDXC UHS-I will be receiving a new 1TB model for packing more games/footage on the go.

Enter the era of DDR5

TEAMGROUP COMPUTEX 2021 DDR5

As speculations of both Intel and AMD adopting the DDR5 standard for their next-generation consumer CPUs, TEAMGROUP’s latest ELITE series memory kits have somehow backed the rumor as they made one of the earliest consumer DDR5 kits that start at 16GB and pushing a 4800MHz baseline clock speed while dropping down operating voltages to 1.1V. Additionally, DDR5 has an ECC chip directly baked in the die as opposed to DDR4’s sitting outside through separate integration.

I personally really wanted to see how much DDR5 can bring to the table especially gaming but that’s Intel and AMD’s trigger so we’ll just have to wait for now.

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