The ‘Taiwan Semiconductor Innovative Products Launch’ scheduled from May 5 to 7 at MITEC is led by the Taiwan International Trade Administration (TITA) alongside the Precision Machinery Research & Development Center (PMC) and the Taiwan External Trade Development Council (TAITRA) in collaboration with SEMICON SEA 2026.
Surrounding the theme of ‘Building a Regional Semiconductor Ecosystem, this event focuses on strengthening bilateral industry ties while reinforcing Taiwan’s role in the broader supply chain.
The program is structured around three core areas – semiconductor packaging, testing, and automation – reflecting segments where Taiwan maintains established technological advantages, particularly in AI and high-performance computing-driven applications. The showcase brings together companies spanning advanced packaging processes, testing interfaces, and production technologies, underscoring Taiwan’s end-to-end capabilities.
Participants in advanced packaging and process technologies include Manz Taiwan with its panel-level packaging solutions for AI and HPC integration, alongside Linco Technology, WinWay, Awesome-Team, Creating Nano Technologies, and Habor Precision, each contributing capabilities ranging from system-in-package shielding and plasma processes to metrology and thermal management systems.
Complementing this, the event also highlights key components and smart manufacturing solutions, with companies such as Kenturn, CHIBIN, TAIWA, Delta Electronics, Shuz Tung, Hanbell, Hour Technology, Syntec, and Bossmen presenting technologies that support precision engineering, smart factory integration, energy efficiency, and cleanroom-ready production environments.
The initiative signals Taiwan’s broader strategy to reinforce supply chain resilience through closer regional cooperation, while Malaysia’s established role in semiconductor packaging and testing positions it as a strategic node in scaling a more integrated and competitive Southeast Asian ecosystem.
