BIOSTAR is making waves at Embedded World North America 2025, currently underway at the Anaheim Convention Center in California, where it’s presenting its latest innovations in edge and industrial computing.
The highlight of the booth is a live Edge AI demonstration in collaboration with MemryX, featuring the EdgeComp N97-MX3 platform. Powered by MemryX’s MX3 acceleration technology, the system delivers up to 24 TFLOPS of AI performance, supporting over 36 channels per module that address real-time AI applications for robotics, automation, and intelligent surveillance.
They also debuted the EdgeComp MS-NANX 16G, built on NVIDIA Jetson Orin NX modules and offering 20 to 100 TOPS of AI computing power within a compact 7 to 25 W power envelope. Supporting major AI frameworks such as LLMs, VLMs, ViT, and Deepseek, it doubles generative AI performance for use cases in smart city infrastructure, logistics, and manufacturing.
Other highlights include the EdgeComp MU-N150, a fanless embedded IPC powered by Intel’s Twin Lake N150 processor with four cores at 3.6 GHz and a 6 W TDP. With DDR5 memory, dual 2.5GbE LAN, and multiple display outputs, it balances power efficiency and connectivity for automation and digital signage applications.
On the other hand, their industrial motherboard lineup is equally comprehensive, spanning the latest Intel Core Ultra and 12th to 14th Gen processors across W880, Q870, W680, Q670, and H610 chipsets. Compact Thin Mini-ITX boards like the BIELK-IHT and BIADN-IHT cater to space-limited environments, while rugged models such as the BIRPL-PAT and BIELK-PAT support extreme temperatures from –40°C to 85°C.
Rounding out its embedded IPC portfolio, systems like the MS-J6412, MS-1335U, MS-N97, MS-X6413E, MS-X7433RE, MT PRO-J6412, and MU-N150 feature fanless designs, robust connectivity, and multi-display support for reliable edge computing.
With strong collaborations with major AI NPU makers, BIOSTAR continues to strengthen its position in the edge AI and industrial computing landscape, enabling scalable, energy-efficient deployments for smart manufacturing, retail, and city environments.
